3M - Low-Melt Glue Sticks
Low-melt is applied at 265 F. to bond heat sensitive substrates such as polystyrene foam. Excellent "hot-tack" when dispensed at low-melt temperatures. Can bond expanded polystyrene, corrugated packaging and displays. 25 second bonding range. FDA listed.
3M - Low-Melt Glue Sticks
| Item | Color | Strength/Material | Length | Add | |
|---|---|---|---|---|---|
GL3M3762Q |
Light Tan |
Low-Melt Glue |
8.000 |
||
GL3M3792Q |
Clear |
Low-Melt Glue |
8.000 |
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